发明名称 AN ELECTRONIC PACKAGE OF PHOTO-SENSING SEMICONDUCTOR DEVICES, AND THE FABRICATION AND ASSEMBLY THEREOF
摘要 A photo-sensing device package and the method of packaging such device is provided. The package includes an assembly portion having a substrate formed of a material substantially transparent to light within a predetermined range of wavelengths; a sensing portion including at least one photo-sensing die photo-electronically transducing light within the predetermined range of wavelengths; and, a plurality of first solder joints joining the sensing and assembly portions. The assembly portion is formed with at least a first metal layer disposed on the substrate about a front surface region thereof; and, at least one passivation layer formed to extend over the first metal layer. The package is cheap and compact, and simply fabricated.
申请公布号 WO2005031873(A1) 申请公布日期 2005.04.07
申请号 WO2004KR02413 申请日期 2004.09.21
申请人 OPTOPAC, INC. 发明人 KIM, DEOK HOON;RECHE, JOHN, J., H.
分类号 H01L23/48;H01L21/00;H01L21/30;H01L21/46;H01L23/00;H01L27/14;H01L27/148;H01L29/40;H01L31/0203 主分类号 H01L23/48
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