发明名称 |
AN ELECTRONIC PACKAGE OF PHOTO-SENSING SEMICONDUCTOR DEVICES, AND THE FABRICATION AND ASSEMBLY THEREOF |
摘要 |
A photo-sensing device package and the method of packaging such device is provided. The package includes an assembly portion having a substrate formed of a material substantially transparent to light within a predetermined range of wavelengths; a sensing portion including at least one photo-sensing die photo-electronically transducing light within the predetermined range of wavelengths; and, a plurality of first solder joints joining the sensing and assembly portions. The assembly portion is formed with at least a first metal layer disposed on the substrate about a front surface region thereof; and, at least one passivation layer formed to extend over the first metal layer. The package is cheap and compact, and simply fabricated. |
申请公布号 |
WO2005031873(A1) |
申请公布日期 |
2005.04.07 |
申请号 |
WO2004KR02413 |
申请日期 |
2004.09.21 |
申请人 |
OPTOPAC, INC. |
发明人 |
KIM, DEOK HOON;RECHE, JOHN, J., H. |
分类号 |
H01L23/48;H01L21/00;H01L21/30;H01L21/46;H01L23/00;H01L27/14;H01L27/148;H01L29/40;H01L31/0203 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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