| 摘要 |
PROBLEM TO BE SOLVED: To provide insulating paste and a semiconductor device for a semiconductor chip mount which ensure high bonding strength in a hot condition, a quick hardening property, heat resistance and a moisture-proof property and can cope with for the enlargement of a semiconductor chip. SOLUTION: The insulating paste and the semiconductor device using the same are characterized by using, as essential elements, (A) an epoxy resin, (B) a hardening agent catalyst represented by (a) an aluminum compound including an organic group, for example, aluminum trysacetyleacenate, (b) a silicone compound or an organosilane compound including one or more OH groups or an alcoxy group coupled in direct to Si within a molecule, for example, diphenyldietoxysilane, and (C) insulating powder. COPYRIGHT: (C)2005,JPO&NCIPI
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