发明名称 |
Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereof |
摘要 |
A photo-sensing device package and the method of packaging such device is provided. The package includes an assembly portion having a substrate formed of a material substantially transparent to light within a predetermined range of wavelengths and a sensing portion having at least one photo-sensing die photo-electronically transducing light within the predetermined range of wavelengths. The assembly portion is formed with at least one metal layer disposed on the substrate about a front surface region thereof, and at least one passivation layer formed to extend over the metal layer. The passivation layer is patterned to define a plurality of first and second access openings respectively about a plurality of first solder wettable pads and at least one second solder wettable pad on the metal layer. Each of the first solder wettable pads is joined by a first solder joint to a solder bump pad formed on the sensing portion, while the second solder wettable pad is joined by a second solder joint to external circuitry.
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申请公布号 |
US2005073017(A1) |
申请公布日期 |
2005.04.07 |
申请号 |
US20040829273 |
申请日期 |
2004.04.22 |
申请人 |
KIM DEOK-HOON |
发明人 |
KIM DEOK-HOON |
分类号 |
H01L21/00;H01L21/50;H01L23/52;H01L27/14;H01L27/146;H01L29/40;H01L31/0203;(IPC1-7):H01L21/00;H01L31/020 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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