发明名称 Method of manufacturing semiconductor device
摘要 A gate electrode is formed on a silicon substrate. First spacers are formed on side surfaces of the gate electrode. With the gate electrode and the first spacers as masks, the surface of the silicon substrate is chipped off to form steplike portions at positions adjacent to base portions of the first spacers. Second spacers are formed at the steplike portions. Silicides are formed on the silicon substrate with the first spacers and the second spacers as masks.
申请公布号 US2005074941(A1) 申请公布日期 2005.04.07
申请号 US20040761186 申请日期 2004.01.22
申请人 NAGATOMO HIROSHI 发明人 NAGATOMO HIROSHI
分类号 H01L21/28;H01L21/336;H01L29/417;H01L29/78;(IPC1-7):H01L21/336;H01L21/823 主分类号 H01L21/28
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