发明名称 METHOD FOR SURFACE TREATMENT
摘要 A surface processing method is provided to perform uniformly surface processing on a substrate by attaching stably the substrate on a surface processing apparatus using the difference of pressure. An enclosed space(32) is formed between a substrate(10) and a surface processing apparatus(1). The substrate and the apparatus are transferred into a pressure reducing chamber in order to generate a negative pressure in the enclosed space. The substrate is stably fixed to the apparatus by using the difference of the negative pressure of the enclosed space and an atmospheric pressure. The substrate fixed apparatus is transferred from the chamber and surface processing is performed on the substrate.
申请公布号 KR20050031995(A) 申请公布日期 2005.04.06
申请号 KR20040077841 申请日期 2004.09.30
申请人 SEIKO EPSON CORPORATION 发明人 ARAKAWA, KATSUJI;KOEDA, HIROSHI;OYA, KAZUFUMI
分类号 C23F1/08;H01L21/02;H01L21/306;H01L21/683;(IPC1-7):H01L21/02 主分类号 C23F1/08
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