发明名称 |
Heat spreader anchoring and grounding method and thermally enhanced PBGA package using the same |
摘要 |
A method and assembly are provided for anchoring the heat spreader of a PBGA package to the substrate thereof as part of the PBGA package. These anchor features are provided over the surface of the substrate of the PBGA package. The anchor features align with openings created in the heat spreader stand-off, thus allowing for quick and reliable positioning and anchoring of the heat spreader over the surface of the substrate of the package.
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申请公布号 |
US6875634(B2) |
申请公布日期 |
2005.04.05 |
申请号 |
US20040804732 |
申请日期 |
2004.03.18 |
申请人 |
ST ASSEMBLY TEST SERVICES PTE LTD |
发明人 |
SHIM IL KWON;APALE HERMES T.;AQUIEN WEDDIE;FILOTEO DARIO;ARARAO VIRGIL;MERILO LEO |
分类号 |
H01L23/433;(IPC1-7):H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L23/433 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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