| 摘要 |
Provided are an adhesive member for an electronic material which is excellent in electrical insulation and heat resistance and can be hot melting bonded under the high temperature taping condition, and a semiconductor device using the adhesive member. The adhesive member is such that it shows an electrical conductivity of 0.01-50 muS/cm at 25 deg.C in the extracted water obtained by adding 10 g of an adhesive layer prepared by using a adhesive composition comprising an epoxy resin, a carboxyl group modified acryl rubber, an amino compound and a bisallylnadiimide or plural layers of adhesive member prepared by layering the adhesive layer on both sides of a core material comprising a heat resistant film of 200 deg.C or more to 100 mL of purified water, and extracting ion impurities at a temperature of 121 deg.C and at a pressure of 2 atm for 24 hours. The total content of twelve ions of F^-, Cl^-, NO2^-, Br^-, NO3^-, PO4^-, SO4^2-, Na^+, NH4^+, K^+, Mg^2+ and Ca^2+ is 10 mg/L or less and the content of each ion is 5 mg/L or less in the extracted water.
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