| 摘要 |
Method of manufacturing a chip card having an antenna support, two card bodies and an electronic module or a chip linked to the antenna. This method has a first lamination step which includes fusing two thermoplastic sheets (32, 34 or 62, 64) on each side of antenna support (10 or 40) at a temperature sufficient for the thermoplastic sheet material to soften and to flow wholly so as to eliminate any differences in thickness from the support, and a second lamination step carried out after a period of time necessary for the thermoplastic sheets (32, 34 or 62, 64) to be solidified, the second step including fusing by hot pressing two plastic layers (36, 38 or 66, 68) making up the card bodies onto the plasticised and even faces of uniformly thick antenna support (30 or 60) plasticised by the thermoplastic sheets.
|
