| 摘要 |
To eliminate such conventional shortcomings that a large-scale semiconductor facility is required, a large facility cannot be produced, and wiring connecting a substrate with another substrate cannot be formed, to eliminate shortcomings in the methods of using an optical fiber as wiring such as being unstable, taking up a space, and difficulty in managing how the increased number of optical fibers are connected, and to eliminate shortcomings in the method of holding and fixing an optical fiber between polymer sheets that wiring cannot be formed on a plate connecting a substrate with another substrate. An optical fiber wiring method and device, wherein an optical fiber, preferably a polymer-made optical fiber, is passed through an adhesive ejecting nozzle having an inner diameter larger than the fiber's outer diameter and is fed out to form an optical fiber covered on the surface thereof with an adhesive, and an optical wiring is formed on a substrate by that optical fiber. An optical wiring is formed on a substrate by a relative movement between the substrate and the nozzle, for example, the nozzle is moved with the substrate fixed or the substrate is moved with the nozzle fixed. An adhesive hardened by being irradiated with a ultraviolet ray is used, an optical fiber covered on the surface thereof with that adhesive is wired on the substrate, and then a ultraviolet ray is applied to thereby form an optical wiring on the substrate. |
