| 摘要 |
<P>PROBLEM TO BE SOLVED: To miniaturize a semiconductor module while sufficiently ensuring the dimension of an electrode terminal plate. <P>SOLUTION: The electrode terminal plate 22 has three portions 22a, 22b, 22c, and linkage is performed by this order. The portion 22a is fixed on a flat surface 3a in parallel to the flat surface 3a by e.g. soldering. One end of a metal wire 31a is connected to a semiconductor element 4, and the other end is connected to the portion 22b, respectively. At a position 10 between the portions 22a, 22b and at a position 11 between the portions 22b, 22c, bending is performed in e.g. right angle, respectively. As a result, the portion 22b is inclined to the flat surface 3a and e.g. extended perpendicularly, and the portion 22c is positioned e.g. in parallel to the flat surface 3a. Further, the other end of the metal wire 31a approaches one end, so that the metal wire 31a presents an arc 31c whose curvature is greater than that before bending the electrode terminal board 22. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
