| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit equipped with an interface circuit for efficiently executing design, and for accurately and quickly executing signal transmission, and to provide an optical disk recording device using its semiconductor integrated circuit. <P>SOLUTION: In an MCM where a plurality of semiconductor chips are integrated into one package, an LVDS circuit using a differential signal is used for an interface between a semiconductor chip A and a semiconductor chip B so that quick and accurate signal transmission can be executed. Furthermore, the differential signal of the LVDS circuit is transmitted between the semiconductor chip A and the semiconductor chip B by providing pads P1a, P2a, P1b, and P2b for connection at positions where it is possible to perform equal length wiring to make the length of each bonding wire 23 and 24 equal. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
