发明名称 Loop thermosyphon for cooling semiconductors during burn-in testing
摘要 A burn-in testing cooling system including an evaporator comprising an upright tubular body having an interior surface and a central passageway with a wick disposed on the interior surface of the body that defines the central passageway. A base seals off the central passageway, with an inlet port arranged in flow communication with an upper portion of the central passageway and an outlet port arranged in flow communication with a lower portion of the central passageway. A coolant is disposed within the central passageway. A condenser is arranged in flow communication with the evaporator.
申请公布号 US2005067147(A1) 申请公布日期 2005.03.31
申请号 US20040929870 申请日期 2004.08.30
申请人 THAYER JOHN GILBERT;ERNST DONALD M. 发明人 THAYER JOHN GILBERT;ERNST DONALD M.
分类号 F25B23/00;F25B39/02;F28D15/04;G01R31/28;(IPC1-7):H05K7/20 主分类号 F25B23/00
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