| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad, obtaining very excellent platen adhesive force, and completely eliminating a pressure sensitive adhesive agent remaining on the platen in the case of separating the pad from the platen after use. <P>SOLUTION: This polishing pad includes: a polishing layer 8 having a polishing surface and a fixed surface; and a pressure sensitive adhesive double coating tape 17 provided on the fixed surface, and in use, the polishing pad is fixed to the platen of a polishing device by the pressure sensitive adhesive double coating tape 17. In the polishing pad, the pressure sensitive adhesive double coating tape 17 includes: a film base material 12; a first pressure sensitive adhesive layer 9 provided on the side of the film base material 12 facing the polishing layer; and a second pressure sensitive adhesive layer 15 provided on the side of the film base material 12 facing the platen, and the second pressure sensitive adhesive layer 15 has a higher adhesive strength to the film base material 12 than the platen. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
