Method for forming metal wiring layer of semiconductor device,申请号KR20020071387-传众专利搜索

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发明名称	Method for forming metal wiring layer of semiconductor device
摘要
申请公布号	KR100480632(B1)	申请公布日期	2005.03.31
申请号	KR20020071387	申请日期	2002.11.16
申请人		发明人
分类号	H01L21/28;B05D5/12;C23C16/00;H01L21/285;H01L21/3205;H01L21/44;H01L21/768;(IPC1-7):H01L21/28	主分类号	H01L21/28
代理机构		代理人
主权项
地址

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