| 摘要 |
<p>The present invention provides an IC socket contact in which the elasticity of a contact arm section, the stability within a housing and the flexibility of a soldered tail section are ensured with minimized inductance. An IC socket contact has a contact arm section that comes into contact with a contact point of an IC package, a fixed section that is fixed to a housing in which the IC package is placed, and a soldered tail section that is soldered to a substrate on which the housing is placed. The contact arm section and the soldered tail section are continuous in a vertical direction. The fixed section is bent back 180° to the back side from a side wall of an intermediate section between the contact arm section and the soldered tail section and extends in a vertical direction.</p> |
