发明名称 Liquid cooling module
摘要 <p>A cooling module designed so that the following components are stacked above a CPU (10): a cooling jacket (1) allowing a cooling liquid to absorb heat generated by the CPU, a pump (2) causing the cooling liquid to circulate, a reserve tank (3) used to provide a supplementary cooling liquid and to bleed air from the cooling liquid, and a first radiator (4) that cools the cooling liquid, the cooling module being also designed so that a second radiator (5) is located at a side of the first radiator (4) to cool the cooling liquid, wherein the cooling liquid is driven by the pump (2) so as to circulate from the cooling jacket (1), which absorbs heat generated by the CPU, through the radiators (4, 5) to the reserve tank (3). <IMAGE></p>
申请公布号 EP1519645(A2) 申请公布日期 2005.03.30
申请号 EP20040005619 申请日期 2004.03.09
申请人 HITACHI, LTD. 发明人 MATSUSHITA, SHINJI;OIKAWA, HIRONORI
分类号 F25D17/02;F25D9/00;F28D1/06;F28F1/24;F28F1/32;G06F1/20;H01L23/473;H05K7/20;(IPC1-7):H05K7/20 主分类号 F25D17/02
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