发明名称 |
Semiconductor plating system workpiece support having workpiece-engaging electrodes with distal contact part and dielectric cover |
摘要 |
A semiconductor workpiece holder used in electroplating systems for plating metal layers onto a semiconductor workpieces, and is of particular advantage in connection with plating copper onto semiconductor materials. The workpiece holder includes electrode assemblies which have a contact part which connects to a distal end of an electrode shaft and bears against the workpiece and conducts current therebetween. The contact part is preferably made from a corrosion resistant material, such as platinum. The electrode assembly also preferably includes a dielectric layer which covers the distal end of the electrode shaft and seals against the contact part to prevent plating liquid from corroding the joint between these parts.
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申请公布号 |
US2005061675(A1) |
申请公布日期 |
2005.03.24 |
申请号 |
US20030716191 |
申请日期 |
2003.11.18 |
申请人 |
BLECK MARTIN C.;GRAHAM LYNDON W.;HANSON KYLE M. |
发明人 |
BLECK MARTIN C.;GRAHAM LYNDON W.;HANSON KYLE M. |
分类号 |
H01L21/687;(IPC1-7):C25D5/02;C25D17/00 |
主分类号 |
H01L21/687 |
代理机构 |
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代理人 |
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