发明名称 |
Solid-state imaging device and method for manufacturing the same |
摘要 |
A solid-state imaging device, comprises: a semiconductor substrate having a first surface; a solid-state imaging element in the first surface of the semiconductor substrate, the solid-state imaging element comprising a light-receiving region; a light-transmission member having a second surface and a third surface, the second surface being opposite to the third surface, wherein the light-transmission member and the first surface of the semiconductor substrate define a gap between the second surface of the light-transmission member and an outer surface of the light-receiving region; and an external connection terminal connected to the solid-state imaging element, wherein a distance between the outer surface of the light-receiving region and the third surface of the light-transmission member is 0.5 mm or more.
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申请公布号 |
US2005062871(A1) |
申请公布日期 |
2005.03.24 |
申请号 |
US20040902885 |
申请日期 |
2004.08.02 |
申请人 |
FUJI PHOTO FILM CO., LTD. |
发明人 |
NISHIDA KAZUHIRO;MAEDA HIROSHI;NEGISHI YOSHIHISA;HOSAKA SHUNICHI;YASUMATSU MASATOSHI;WATANABE EIJI |
分类号 |
H01L27/14;H01L27/146;H01L27/148;H01L31/0232;H01L31/10;H04N5/225;H04N5/335;H04N5/369;H04N5/372;(IPC1-7):H04N5/225 |
主分类号 |
H01L27/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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