| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly efficient thermal diffusion structure for miniaturization of electronic components in an electronic apparatus and higher functionality thereof. SOLUTION: A liquid sealing portion 20 is provided on a cover on the side of an electronic component 7 constituting a water cooling jacket 15 mounted on the upper part of the electronic component 7. Further, a thermal diffusion plate meandering from near the center of the water cooling jacket 15 is provided within this liquid sealing portion 20. Thus, the heat generated from the electronic component 7 can be spread over whole cover 16, 17 on the side of the electronic component 7 by the evaporation heat of the liquid. The spread heat is conducted to a cooling liquid circulating through a liquid passage 19 of the water cooling jacket 15 and can be radiated into atmosphere at a site of a cabinet having a large radiating area. Further, the heat generated from the electronic component 7 can be spread to the wider-area water cooling jacket 15. COPYRIGHT: (C)2005,JPO&NCIPI |
