COOLING DEVICE FOR DISSIPATING THERMAL LOSSES FROM AN ELECTRIC OR ELECTRONIC COMPONENT OR A SUB-ASSEMBLY AND COOLER

摘要

The invention relates to a novel device for dissipating the thermal losses of an electric or electronic component or a sub-assembly to a remote external cooler. Said device comprises a coolant circuit between the component or sub-assembly and the external cooler. The circuit contains at least one primary cooler that is traversed by the coolant and absorbs the thermal losses of the component or sub-assembly and at least one secondary cooler in the external cooler that is traversed by the coolant, said secondary cooler comprising a plurality of cooling fins.