发明名称 |
METHOD OF MANUFACTURING FLASH MEMORY DEVICE WITH POLYSILICON LAYERS CONNECTED PHYSICALLY ELECTRICALLY WITH EACH OTHER |
摘要 |
PURPOSE: A method of manufacturing a flash memory device is provided to improve the degree of integration as well as the contact resistance and sheet resistance of a select line by connecting electrically all polysilicon layers in person through a dielectric removed portion. CONSTITUTION: A substrate(301) with isolation layers(305) and first polysilicon patterns(306) is provided. A dielectric layer is formed on the entire surface of the resultant structure. The dielectric layer is selectively removed from the first polysilicon patterns. A second polysilicon layer(308) and a conductive material layer(309) are sequentially formed thereon. A select line and a word line are formed by performing a patterning process on the resultant structure.
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申请公布号 |
KR20050024706(A) |
申请公布日期 |
2005.03.11 |
申请号 |
KR20030060792 |
申请日期 |
2003.09.01 |
申请人 |
HYNIX SEMICONDUCTOR INC. |
发明人 |
AHN, JUNG RYUL;KIM, JUM SOO |
分类号 |
H01L21/28;H01L21/336;H01L21/8239;H01L21/8246;H01L21/8247;H01L27/115;H01L29/423;H01L29/49;H01L29/788;H01L29/792;(IPC1-7):H01L27/115 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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