| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board in which a large-sized semiconductor element is mounted certainly by preventing a flow of an uncured underfill material from being disturbed due to an erosion treatment and to provide a semiconductor packaging wiring board. SOLUTION: This board 11 does not have a glass crystallization phase on one surface side front layer part of an insulator, contains an Si of 50-90 mol% in terms of SiO<SB>2</SB>, and mounts the semiconductor element 12 via an underfill material 14. Another wiring board has an area ratio of a glass recognized on a front surface of one surface side of 40% or more. This semiconductor element packaging wiring board 1 includes the wiring board 11 having an element connecting terminal 111, a semiconductor element 12 having a substrate connecting terminal 121, a connecting material 13 and the underfill material 14. One surface side front layer part having the element connecting terminal of the wiring board does not have the glass crystallization phase, but contains the Si of 50-90 mol% in terms of SiO<SB>2</SB>. The other semiconductor element packaging wiring board has an area ratio of a glass recognized on the front surface of the one surface side of 40% or more. COPYRIGHT: (C)2005,JPO&NCIPI
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