| 摘要 |
PROBLEM TO BE SOLVED: To provide an MCM (Multi-Chip Module) semiconductor device having a plurality of chips, which enables high speed operation and low power consumption and can protect a circuit element from electrostatic damage during device manufacturing. SOLUTION: Signal lines between chip internal circuits 30 and 32 are electrically directly connected to enable lower power consumption and high speed operation. A protection circuit 406 for protecting from electrostatic damage is provided on the signal lines. When the chip internal circuits 30, 32 are connected by connection wires 12 during device manufacturing, a protection circuit 406 is previously connected to the signal lines (internal lead 12a, internal wire 14). Consequently, even when charges accumulated in semiconductor chips 20, 22 flow into the signal lines, the protection circuit 406 protects the circuit element from static electricity by sucking it. Since the protection circuit 406 is separated from the signal lines after the completion of the connection, the protection circuit 406 can be avoided from becoming loads for the chip internal circuit 30, 32 in its normal use and thus the reduction of an operational speed can be prevented. COPYRIGHT: (C)2005,JPO&NCIPI |
