| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board which is capable of ensuring conduction reliability for a conductor pattern even on a high-density printed wiring board, and to provide the printed wiring board. SOLUTION: The printed wiring board 12 is equipped with conductor patterns 11 provided on both the surfaces of an insulating substrate 1 and a plating through-hole through which the conductor patterns 11 are electrically connected together, and the plating through-hole is provided with a plating layer 4 on the inner wall of the through-hole penetrating through the insulating substrate 1 from its front surface to rear surface. The thickness B of the plating layer 4 is one to five times as large as the thickness A of the conductor pattern 11. The conductor pattern 11 is composed of a plurality of laminated one conductor layers 6 formed on the insulating substrate 1 and other conductor layers 9 provided in the detaching direction from the insulating substrate 1, and the surface of the one conductor layer 6 abutting against the surface of the other conductor layer 9 is roughened. COPYRIGHT: (C)2005,JPO&NCIPI
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