| 摘要 |
An optical module, for semiconductor optical devices, includes an optical device 14 and alignment blocks 15 mounted on a submount 16 which is joined to the surface of an alignment plate 1 having an open cut-out. A fibre carrier component is provided for positioning and fixing an optical fibre or a plurality of optical fibres. The fibre carrier has an overhang feature to align the fibre to the optical device through a reference surface on the alignment plate. The aligned assembly is joined to an interconnect plate 20 which provides efficient electrical interconnection to the optical device through the open cut-out. V-shaped grooves 3,9,12 may be provided for optic fibres 17. Interconnect plate 20 may include electrical contacts (21, Fig.4) and conductive tracks (22, Fig.4). Optical device 14 may be a laser diode, light-emitting diode or photodetector. A collimating lens (57, Fig.28) may be used. The module may be sealed by a window (73, Fig.32). Figs 29-32 illustrate an embodiment without a coupled optic fibre. |
