THIN SEMICONDUCTOR PACKAGE WITH STACKABLE LEADFRAME AND FABRICATING METHOD THEREOF TO POSITION EXTERNAL LEAD ON THE SAME PLANE WITHOUT VARYING EXTERNAL LEAD

摘要

PURPOSE: A thin semiconductor package with a stackable leadframe is provided to position an external lead on the same plane without varying the external lead by using a flat leadframe as a terminal pad part. CONSTITUTION: A semiconductor chip(34) is mounted on a paddle part(26) of a leadframe while the front surface of a semiconductor chip faces downward, wherein a hole is formed in the center part of the paddle part. The lower surface of the paddle part is electrically connected to a bonding pad of the semiconductor chip whose surface faces downward by a wire(36). A terminal pad part(28) having an upper surface higher than the paddle part and a lower surface lower than the paddle part is formed in the edge of the leadframe, connected to an external terminal. An intermediate lead(30) connects the paddle part with the terminal pad part. The semiconductor chip and the wire are protected and molded by encapsulant.