发明名称 |
MICROMECHANICAL APPARATUS AND METHOD OF FORMING A MICROMECHANICAL DEVICE LAYER |
摘要 |
A method of forn-ting a MEMS device produces a device layer wafer having a pre-formed conductive pathway before coupling it with a handle wafer. To that end, the method produces the noted device layer wafer by 1) providing a material layer, 2) coupling a conductor to the material layer, and 3) forn-ting at least two conductive paths through at least a portion of the material layer to the conductor. The method then provides the noted handle wafer, and couples the device layer wafer to the handle wafer. The wafers are coupled so that the conductor is contained between the material layer and the handle wafer. |
申请公布号 |
WO2005001859(A3) |
申请公布日期 |
2005.03.03 |
申请号 |
WO2004US18978 |
申请日期 |
2004.06.16 |
申请人 |
ANALOG DEVICES, INC.;WACHTMANN, BRUCE, K.;JUDY, MICHAEL |
发明人 |
WACHTMANN, BRUCE, K.;JUDY, MICHAEL |
分类号 |
B81B3/00;B81B7/00;B81C1/00;H01G;H01L21/8238;H01L27/14 |
主分类号 |
B81B3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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