| 摘要 |
<p>A semiconductor wafer, a semiconductor device, and a method of manufacturing the semiconductor device which prevent corrosion of pads in a semiconductor integrated circuit. A semiconductor wafer having semiconductor integrated circuits and interconnections extending from wire-bonding pads on the semiconductor integrated circuits to a dicing line is cut along the dicing line into chips. Part of the interconnections are left on the chips as wafer testing pad remainders, and the surfaces of the wafer testing pad remainders are covered with an insulating film, preventing the invasion of water from the wafer testing pad remainders and corrosion of the wire-bonding pads in the semiconductor integrated circuit, improving reliability and durability of the semiconductor device.</p> |
