| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an immersion type two-surface heat-radiation power module having an efficient heat radiating structure with thermal resistance factors as in presence in the conventional model eliminated. <P>SOLUTION: A package 2 is shaped into a box and houses a module structure 3 provided with a power element 31, to be immersed in cooling water in a cooler 5. Both surfaces of the module structure 3 are brought into close contact with inner surfaces of the package 2, with thermoconductive insulating layers 4 respectively sandwiched in between. A cover 22 is provided on one surface of the box-shape package 2 wherewith the module structure 3 is in close contact, and the cover 22 is capable of adjusting its distance from the other surface of the package 2 for pressing and fixing the module structure 3 immovable. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
