CERAMIC BOARD AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a ceramic wiring board for preventing warpage in a manufacturing process of a board and a crack in a component mounting process in the printed board having break lines for dividing child boards from a thin ceramic mother board. SOLUTION: The break lines 12 and 13 are vertically and laterally formed in parallel on the surface and the rear face of the thin ceramic board 11 in an almost square shape. The break lines 12 and 13 are alternately and non-oppositely formed on the surface and the rear face. COPYRIGHT: (C)2005,JPO&NCIPI