| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrostatic chuck inhibiting a rise in temperature by improving the cooling properties of a mounting surface, preventing the occurrence of cracks and dielectric breakdown of an insulating film due to a difference in thermal expansion from a substrate, and having satisfactory wafer attracting/disengaging properties. SOLUTION: There are provided an insulating layer 3 on one main surface of a conductive substrate 2, electrodes for attracting 4a and 4b on its top surface, and an insulating film 5 in such a manner as to cover the electrodes for attracting 4a and 4b. With its top surface as a mounting surface 5a mounting a wafer W, the total thickness of the insulating layer 3 and the insulating film 5 is 20 to 2000μm. COPYRIGHT: (C)2005,JPO&NCIPI |
