| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame which can solve troubles in a process caused by resin residue remaining in the eject hole side surface of the lead frame in all the resin sealed semiconductor devices including a QFN type and a QFP type, and the manufacturing method of a resin sealed semiconductor device using it. SOLUTION: The device has a lead frame body 1 consisting of a metallic plate, a die pad 2 arranged inside a region of the frame body 1 and a bonding lead 3 wherein a tip is opposed to the die pad 2 and the other end thereof is connected to the frame body 1, and a metallic fine line is connected to the surface thereof. An eject hole 4 is provided on a lead frame which a runner passes through in a sealing process so as to realize easy gate brake and runner degate after sealing. A groove 5 and a through hole which are subjected to etching process and press process are provided along the eject hole 4. COPYRIGHT: (C)2005,JPO&NCIPI
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