| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and process for manufacturing a semiconductor device in which residual balls in transfer mounting can be removed surely and efficiency. SOLUTION: The apparatus for manufacturing a semiconductor device comprises a section 5 for supplying conductive balls 4, a mounting head 3 having a holding surface for suction holding the conductive balls 4 at a plurality of suction holes, a mounting section 7 for supporting an article 23 mounting the conductive balls 4, and a mechanism 1 for moving the mounting head 3 relatively between the supplying section 5 and the mounting section 7. The manufacturing apparatus mounts the conductive balls 4 held by the mounting head 3 at the supplying section 5 on the mounting article 23 at the mounting section 7. A means 6 for removing unnecessary conductive balls 4 or contaminations being left on the mounting head 3 after the conductive balls 4 are mounted on the mounting article 23 is provided in the relative movement passage of the mounting head 3 between the supplying section 5 and the mounting section 7. COPYRIGHT: (C)2005,JPO&NCIPI
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