发明名称 |
Multifunctional metallic bonding |
摘要 |
Methods are provided for producing a transfer layer of a semiconductor material on a final substrate. In some embodiments, the transfer layer is produced on the final substrate by forming a layer of semiconductor material on an initial support, assembling that layer and a final substrate by metal bonding, and mechanically separating the initial support from the layer at a weak interface that initially attached the layer to the initial support. An intermediate substrate can be obtained which can be used to fabricate a variety of components such as light-emitting diodes or laser diodes. These techniques can produce a transfer layer on a final substrate and a recyclable initial support that can be detached from the transfer layer for recycling by dint of non-destructive mechanical release.
|
申请公布号 |
US2005048739(A1) |
申请公布日期 |
2005.03.03 |
申请号 |
US20030744867 |
申请日期 |
2003.12.22 |
申请人 |
KERDILES SEBASTIEN;LETERTRE FABRICE;MORALES CHRISTOPHE;MORICEAU HUBERT |
发明人 |
KERDILES SEBASTIEN;LETERTRE FABRICE;MORALES CHRISTOPHE;MORICEAU HUBERT |
分类号 |
H01L21/762;H01L33/00;(IPC1-7):H01L21/00;H01L21/30;H01L21/46;H01L21/301 |
主分类号 |
H01L21/762 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|