发明名称 |
Two component, curable, hot melt adhesive |
摘要 |
A two component, curable hot melt adhesive system includes a first hot melt adhesive formulation which has a softening temperature greater than room temperature and which includes a first component of a curable adhesive therein. The system includes a second hot melt adhesive formulation which has a softening temperature which is greater than room temperature and which includes a second component of a curable adhesive therein. The second component is reactive with the first component to provide a cured adhesive bond. In use, the two formulations are heated to a temperature above their softening temperature and are contacted so as to cause mixing. The mixture cools to provide a thermoplastic bond which subsequently cures to provide a permanent adhesive bond. While the first and the second component individually perform as hot melt adhesives, combining the first and the second gives enhanced adhesive performance in extended temperature ranges.
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申请公布号 |
US6861464(B2) |
申请公布日期 |
2005.03.01 |
申请号 |
US20020199379 |
申请日期 |
2002.07.19 |
申请人 |
DIVERSIFIED CHEMICAL TECHNOLOGIES, INC. |
发明人 |
EADARA RAJAN;CHUNG MOOIL;CHANG DAVID WEN-LUNG;GEORGE SUNNY K.;OHAKA PATRICK A.;JOSEFF JORIBETH E.;AHN YUSHIN |
分类号 |
C08L23/06;C08L31/04;C08L77/00;C08L91/00;C09J5/04;C09J5/06;C09J123/08;(IPC1-7):C08L31/04 |
主分类号 |
C08L23/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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