| 发明名称 |
RE-PEELABLE PRESSURE-SENSITIVE ADHESIVE SHEET COMPRISING ADHESIVE AGENT LAYER, BASE FILM AND INTERMEDIATE LAYER WITH SPECIFIC RANGE OF STORAGE ELASTIC MODULUS |
| 摘要 |
<p>PURPOSE: Provided a re-peelable pressure-sensitive adhesive sheet capable of preventing a semiconductor wafer from being warped even when adhered to the semiconductor wafer under a heating environment. CONSTITUTION: The re-peelable pressure-sensitive adhesive sheet, comprises an adhesive agent layer(13) formed on a base film(11) and at least one intermediate layer(12) between the base film(11) and the adhesive agent layer(13), wherein the intermediate layer(12) has a storage elastic modulus(G') of 3.0x10¬4 to 1.0x10¬8 Pa at 23 deg.C and a storage elastic modulus(G') of 1.0x10¬3 to 8.0x10¬4 Pa at 200 deg.C. Preferably, the intermediate layer is formed of an organic viscoelastic body having a gel fraction of 40 wt% or less or a thermoplastic resin having a melting point of 7 0deg.C or below.</p> |
| 申请公布号 |
KR20050016168(A) |
申请公布日期 |
2005.02.21 |
| 申请号 |
KR20040061746 |
申请日期 |
2004.08.05 |
| 申请人 |
NITTO DENKO CORPORATION |
发明人 |
AKAZAWA, KOUJI;KIUCHI, KAZUYUKI;MATSUMURA, TAKESHI;TAKAHASHI, TOMOKAZU |
| 分类号 |
B32B7/12;C09J7/02;C09J9/00;C09J133/00;C09J201/00;H01L21/301;H01L21/304;H01L21/68;H01L21/683;(IPC1-7):C09J7/02 |
主分类号 |
B32B7/12 |
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