| 摘要 |
PROBLEM TO BE SOLVED: To prevent the effects of heat in a reticle and a wafer chuck. SOLUTION: A chuck 110 having high specific stiffness and a high thermal conductivity compared to conventional chucks is used, and encoders 220 and 220' for measuring thermal expansion in the chuck 110 are provided. High specific stiffness provides a higher control bandwidth and improved scanning performance. Accurate measurement of the coefficient of thermal expansion and strain enables scaling factor correction or the like, thereby attaining excellent positioning accuracy. COPYRIGHT: (C)2005,JPO&NCIPI
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