| 摘要 |
PROBLEM TO BE SOLVED: To provide conductive particles of a fine grain diameter which is superior in a crimping resistance characteristic, and in which base material particles of particle size of 5μm or less are used. SOLUTION: This is the conductive particles of the fine grain diameter having a buffer plating layer composed of an Fe base or an Ni base corrosion resistance alloy of the average film thickness 0.01 to 0.1μm on a surface of base material particles of particle size of 0.5 to 5μm (for example silica particle or divinyl benzene resin series particle), and having a Pd plating layer or a Pd alloy plating layer of the average film thickness 0.01 to 0.1μm on the buffer plating layer. For the buffer plating layer, (i) an Fe base corrosion resistance alloy containing Cr: 13 to 30 wt%, Ni: 3 to 20 wt%, (ii) a Ni base corrosion resistance alloy containing Mo: 20 to 35 wt%, Fe: 2 to 10 wt%, and (iii) a Ni base corrosion resistance alloy containing Cr: 10 to 25 wt%, Mo: 3 to 20 wt%, Fe: 2 to 25 wt%, can be suitably used. The respective plating layers can be formed by a sputtering method. COPYRIGHT: (C)2005,JPO&NCIPI
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