| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring base material for intermediate connections and a multilayer wiring board wherein its treatment quality in the case of its laminating process is excellent and an extremely high positional accuracy can be obtained by it, by solving the problem that, in the manufacturing method of the multilayer wiring board used in a small-sized, light, and highly functional electronic appliance, there are so increased the laminating processes of intermediate connecting bodies on core boards when increasing wiring layers in conventional sequentially laminating method as to complicate the processes of the multilayer wiring board, as to accumulate the generations of its faultiness, and as to reduce its yield. SOLUTION: As a unit wiring board for constituting the multilayer wiring board, the constitution is given wherein there are provided a wiring board 14 having a plurality of wiring layers 12a, 12b connected with each other through via-hole conductors 13a provided in the inside of an insulation layer 11, and insulation layers 15 comprising prepreg sheets having via-hole conductors 13b in the predetermined positions thereof at least one of which is disposed on a single side of the wiring board 14. COPYRIGHT: (C)2005,JPO&NCIPI |
