发明名称 HEAT UTILIZING MATERIAL
摘要 <P>PROBLEM TO BE SOLVED: To provide a heat utilizing material of a new material having high practicality, including a wide temperature range of -30 to 200&deg;C and utilizable especially within the temperature range of 50-200&deg;C which has not been achieved. <P>SOLUTION: The heat utilizing material is composed of an organic salt which is formed of an organic acid and an organic base and is a solid at normal temperature. The interaction between different kinds of molecules in the organic salt and reversible formation and dissociation energy thereof are utilized for the heat utilizing material. The magnitude of the interaction energy between the molecules can freely be selected by selecting the suitable combination of the molecules according to purposes. Since the molecules of a simple structure can be used as constituent molecules, the production is simple at a low cost. Since the formation and dissociation of the organic salt are reversible and the dissociated molecules can repetitively be used several times, the heat utilizing material can be used as a thermal storage medium of high heat storage volume. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005041908(A) 申请公布日期 2005.02.17
申请号 JP20030199908 申请日期 2003.07.22
申请人 MITSUBISHI CHEMICALS CORP 发明人 TAKUMI HIDEAKI;MURAKOSHI AKIKO;KAKIUCHI HIROYUKI;HIDAKA HIDETO
分类号 F24F5/00;C09K5/06;F28D20/00 主分类号 F24F5/00
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