发明名称 ELECTRONIC COMPONENT MOUNTING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide an electronic component mounting device capable of carrying out a component mounting work while coping with a component supplying position through a component supplying device or the fluctuation of the size of a substrate into the direction of Y-axis in spite that the device is small-sized and inexpensive. <P>SOLUTION: When the substrate is a small-sized substrate 47s and a component is supplied from the component stage 59 of a tray-type component supplying device 58, a Y-axis ball screw unit 70f for front side inscribed to Y-axis rails 52a, 52b is moved to respective ends of the front side and, fastened with screws 73 (a diagram with respect to the Y-axis rail 52b is omitted). When the substrate is a large-sized substrate 47L and the component is supplied from a tape-reel type component supplying device 49, the Y-axis ball screw unit 70f is moved to the substantially central part of respective Y-axis rails 52a, 52b and, fastened with screws 73. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005045020(A) 申请公布日期 2005.02.17
申请号 JP20030277545 申请日期 2003.07.22
申请人 YAMAGATA CASIO CO LTD 发明人 TAKAHASHI TAKAYUKI
分类号 H05K13/04 主分类号 H05K13/04
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