发明名称 POSITIVE PHOTORESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive photoresist composition having high exposure latitude for forming a resist pattern on a substrate and capable of forming a pattern with excellent resolution and perpendicularity, and to provide a method for forming a resist pattern. <P>SOLUTION: The positive photoresist composition contains: (A) an alkali-soluble novolac resin in which hydrogen atoms in all of the phenolic hydroxyl groups are partially substituted for 1,2-naphthoquinone diazide sulfonyl groups; and (B) a dissolution accelerator expressed by general formula (I). <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005037494(A) 申请公布日期 2005.02.10
申请号 JP20030197873 申请日期 2003.07.16
申请人 TOKYO OHKA KOGYO CO LTD 发明人 MASUDA YASUO;OKUI TOSHIKI
分类号 G03F7/004;G03F7/023;H01L21/027 主分类号 G03F7/004
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