CHIP TYPE SURGE ABSORBER AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a chip type surge absorber capable of preventing, even if a terminal electrode is sealed by a brazing material, scattering of its metal constituent in main discharge. SOLUTION: A pair of terminal electrode members 6 and 7 of this chip type surge absorber 1 have flange parts 11; and projecting support parts 12 axially projecting into the inside of a tubular ceramics (insulating tube) 8 and in an axial direction for supporting a cylindrical ceramic member (insulating member) 5 by the radial inside surfaces 12a. Center regions 13 are formed at positions facing to ends of the cylindrical ceramics 5 by being surrounded by the support parts 12. Four brazing material guide grooves 15 extending inward in the radial direction from centers of the respective side parts of the flange parts 11 and reaching the center regions 13 are formed on a pair of the electrode members 6 and 7. Two out of the four guide grooves 15 are so structured as to extend inward in the radial direction from the centers of long side parts of the flange parts 11 where the distance between each flange part 11 and each center region 13 is minimized. COPYRIGHT: (C)2005,JPO&NCIPI