SEMICONDUCTOR LIGHT EMITTING DEVICE, LIGHT EMITTING MODULE, AND LIGHTING APPARATUS

摘要

An LED array chip (2) includes blue LEDs (6) and red LEDs (8) . The blue LEDs (6) are formed by epitaxial growth on an SiC substrate (4). Bonding pads (46 and 48) are formed on the SiC substrate (4) in a wafer fabrication process. The red LEDs (8) are separately manufactured from the blue LEDs (6) , and flip-chip mounted on the bonding pads (46 and 48) formed on the SiC substrate.