| 发明名称 |
Method for separating semiconductor wafer from supporting member, and apparatus using the same |
| 摘要 |
A work is suction-held by an upper suction chuck stage from the surface side of a supporting member, is moved upward to a predetermined height, and is heated in a state where the thickness direction of a both-faced adhesive sheet is not restricted, and a dicing tape is cooled. After lapse of predetermined heating time, the work is separated from the both-faced adhesive sheet whose adhesive strength is weaken, and drops to a lower suction chuck stage.
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| 申请公布号 |
US2005032332(A1) |
申请公布日期 |
2005.02.10 |
| 申请号 |
US20040939429 |
申请日期 |
2004.09.14 |
| 申请人 |
MIYAMOTO SABURO;HASE YUKITOSHI |
发明人 |
MIYAMOTO SABURO;HASE YUKITOSHI |
| 分类号 |
H01L21/67;B32B43/00;B65H41/00;H01L21/00;H01L21/30;H01L21/301;H01L21/304;H01L21/68;H01L21/78;(IPC1-7):H01L21/78 |
主分类号 |
H01L21/67 |
| 代理机构 |
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代理人 |
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