发明名称 |
Sealing material composition for cards and process for producing cards using the composition |
摘要 |
<p>A sealing material composition for cards which comprises (A) an acrylate compound polymerizable by an ionizing radiation and (B) 1 to 40 parts by weight of a polyfunctional isocyanate compound per 100 parts by weight of the acrylate compound and can be cured by irradiation of the ionizing radiation and a process for producing cards comprising disposing a coating layer comprising the above sealing material composition between a substrate sheet and a cover sheet and curing the coating layer by irradiation of an ionizing radiation. The sealing material composition gives excellent adhesion between a substrate sheet and a cover sheet and provides cards having faces with little unevenness, suitable flexibility and excellent reliability. The process provides cards having the above characteristics. <IMAGE></p> |
申请公布号 |
EP1081201(B1) |
申请公布日期 |
2005.02.09 |
申请号 |
EP20000116279 |
申请日期 |
2000.08.09 |
申请人 |
LINTEC CORPORATION |
发明人 |
NAKATA, YASUKAZU;ICHIKAWA, AKIRA;TAGUCHI, KATSUHISA;IWAKATA, YUICHI |
分类号 |
G06K19/07;C09J4/00;C09J4/02;C09J175/00;C09K3/10;G06K19/02;G06K19/077;H01L23/29;H05K3/28;(IPC1-7):C09J4/02;C09J11/06 |
主分类号 |
G06K19/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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