| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which is smaller in size and lower in price than that requesting a pad for grounding to the conventional pad for radio frequency, and also to provide a method of measuring the same. SOLUTION: The semiconductor device comprises a semiconductor substrate 1 on which a plurality of chip regions 3 including a semiconductor chip 2 are allocated, a scribe region 4 provided between chip regions 3, and a conductive material 5 provided in this scribe region 4. This semiconductor chip 2 includes, in the same side as the forming surface of conductor material 5 provided on the semiconductor substrate 1, at least a first pad 2a for the grounding and a second pad 2b for radio frequency. Since the first pad 2a is electrically connected to the conductor material 5, the conventional second pad is no longer required. Accordingly, a small size and low price semiconductor device can be obtained. COPYRIGHT: (C)2005,JPO&NCIPI
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