发明名称 |
Reworkable thermal interface material |
摘要 |
A process of making a reworkable thermal interface material is described. The reworkable thermal interface material is bonded to a die and a heat sink. The reworkable thermal interface material includes a phase-change polymer matrix material. Other materials in the reworkable thermal interface material can include heat transfer particles and low melting-point metal particles. The phase-change polymer matrix material includes a melting temperature below a selected temperature and the heat transfer particles have a melting temperature substantially above the selected temperature. The heat transfer particles act as a spacer limit, which holds the thermal interface material to a given bond-line thickness during use.
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申请公布号 |
US2005027055(A1) |
申请公布日期 |
2005.02.03 |
申请号 |
US20030630550 |
申请日期 |
2003.07.29 |
申请人 |
INTEL CORPORATION |
发明人 |
DANI ASHAY A.;GILBERT SCOTT;SATHE AJIT V.;PRASHER RAVI |
分类号 |
C09K5/06;H01L23/373;(IPC1-7):C09K3/18;C08K3/08 |
主分类号 |
C09K5/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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