发明名称 Reworkable thermal interface material
摘要 A process of making a reworkable thermal interface material is described. The reworkable thermal interface material is bonded to a die and a heat sink. The reworkable thermal interface material includes a phase-change polymer matrix material. Other materials in the reworkable thermal interface material can include heat transfer particles and low melting-point metal particles. The phase-change polymer matrix material includes a melting temperature below a selected temperature and the heat transfer particles have a melting temperature substantially above the selected temperature. The heat transfer particles act as a spacer limit, which holds the thermal interface material to a given bond-line thickness during use.
申请公布号 US2005027055(A1) 申请公布日期 2005.02.03
申请号 US20030630550 申请日期 2003.07.29
申请人 INTEL CORPORATION 发明人 DANI ASHAY A.;GILBERT SCOTT;SATHE AJIT V.;PRASHER RAVI
分类号 C09K5/06;H01L23/373;(IPC1-7):C09K3/18;C08K3/08 主分类号 C09K5/06
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