| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component achieved in miniaturization by effectively utilizing a face mounting a substrate, its resin substrate, and a method of manufacturing the electronic component. SOLUTION: In such a constitution that the packaging region 24 of an electronic circuit in a dielectric printed circuit board 2 is covered with a metal shielding case 3, an end electrode 21 that is formed on the side of the dielectric printed circuit board 2 is constituted in such a manner that it does not reach a first face 2a that is a packaging face. Thereby, the first face can be efficiently used as the packaging region without requiring a region for constituting the end electrode 21 on the first face 2a. Moreover, the shielding case 3 is fixed to the dielectric printed circuit board 2 by joining or bonding a sidewall 31 to the first face 2a. Thereby, the first face can be efficiently used as the packaging region without requiring a groove or the like for engaging the shielding case 3 in the dielectric printed circuit board 2. From the above, the mounting face can be effectively utilized, so that the miniaturization of electronic components is permitted. COPYRIGHT: (C)2005,JPO&NCIPI
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