发明名称 |
HEAT SINK MOUNTING ASSEMBLY FOR SURFACE MOUNT ELECTRONIC DEVICE PACKAGES |
摘要 |
<p>A mounting assembly for thermally coupling a heat sink to a surface mounted heat generating electronic device package. The mounting assembly essentially comprises a heat generating device package, a mounting attachment, and a heat sink. The mounting attachment and heat generating device package are surface mounted to a PCB or other substrate in mutual thermal communication with a thermal pad on the substrate. The mounting attachment is adapted to facilitate the effective dissipation of heat from surface mounted heat generating electronic device packages while allowing for the post-manufacture installation and exchange of heat sinks.</p> |
申请公布号 |
EP0962123(B1) |
申请公布日期 |
2005.02.02 |
申请号 |
EP19980953919 |
申请日期 |
1998.10.23 |
申请人 |
THERMALLOY INCORPORATED |
发明人 |
CLEMENS, DONALD, LYNN;KUZMIN, GARY, K. |
分类号 |
H05K7/20;H01L23/40;(IPC1-7):H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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